Research Scientist, Multi-Layered Wiring

Are you interested in superconducting quantum device fabrication and advanced nanofabrication processes? We are offering an exciting opportunity to work at the forefront of quantum hardware development. Would you like to develop innovative technology with superb colleagues who are top experts in their field? Do you want to work at the interface of academia and industry? Are you enthusiastic about working on fascinating projects in state-of-the-art research facilities? VTT might be just the place for you. VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra . We are now looking for Research Scientist, Multi-Layered Wiring to join our Quantum Scaling and Integration team. You will join our Quantum Scaling and Integration Team, contributing to the development of advanced nanofabrication processes for superconducting multi-layered wiring stacks on 200 mm wafers — a critical technology for scaling quantum processors. In this role, you will work hands-on in cleanroom and characterization environments, collaborating closely with senior scientists and cross-functional teams. You will contribute both to cutting-edge research and to building reproducible, pilot-ready manufacturing capabilities. Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors — from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems. As Research Scientist, Multi-Layered Wiring), you will: Develop, optimize, and qualify nanofabrication processes for superconducting multi-layered wiring stacks Perform thin film deposition, lithography, dry etching (RIE/ICP), and wet processing Contribute to process integration, scaling, and transfer across fabrication platforms Plan and execute design-of-experiments (DOE) and analyze data for process optimization Improve process stability, reproducibility, and wafer-scale uniformity Carry out in-line and wafer-level characterization (e.g. SEM, electrical probing) Analyze process-performance relationships and support continuous improvement Support process control, yield tracking, and KPI definition Collaborate with internal teams and external partners in EU projects and research initiatives Contribute to documentation, technology transfer, and pilot-scale process development Who we are looking for: For this position, we are looking for a hands-on expert in micro- and nanofabrication with a strong interest in quantum technologies. MSc or PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar At least 3 years of cleanroom experience (incl. thesis or postdoc work) Experience in lithography, etching, thin film deposition, and microfabrication processes Understanding of process integration, characterization, and fabrication workflows Experience with DOE, data analysis, or process optimization Basic programming skills (e.g., Python) We also appreciate experience in experience with SPC, yield analysis, or process control methodologies; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with superconducting materials or quantum devices. As a person, we hope that you are: Hands-on, detail-oriented, and focused on data quality and reproducibility A proactive problem solver with a continuous improvement mindset Able to work both independently and in cross-functional teams A clear communicator who can explain technical topics to diverse audiences Structured and committed to quality, safety, and documentation Curious, open-minded, and motivated to work on new topics Apply now and join our community of brilliant minds! Please send your CV with your salary request via our recruitment system as soon as possible but at the latest by 23 September 2026. Interested and want to know more? For further information, please contact Research Team Leader Harshad Mishra, [email protected] , +358 50 525 7122. We look forward to hearing from you! Apply between 7 September 2026 and 23 September 2026 23:59 (Europe/Helsinki) Employment type: full time VTT